Patent Assignment Details
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| Reel/Frame: | 008908/0202 | |
| Pages: | 3 |
| | Recorded: | 11/26/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/20/2000
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Application #:
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08978694
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Filing Dt:
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11/26/1997
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Title:
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POLISHING PAD AND APPARATUS FOR POLISHING A SEMICONDUCTOR WAFER
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Assignee
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| OSAKA-SHI |
| 5-33, KITAHAMA 4-CHOME, CHUO-KU |
| OSAKA, JAPAN |
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Correspondence name and address
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BARNES & THORNBURG
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MICHAEL S. GZYBOWSKI
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600 ONE SUMMIT SQUARE
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FORT WAYNE, IN 46802
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