Patent Assignment Details
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Reel/Frame: | 009062/0150 | |
| Pages: | 4 |
| | Recorded: | 02/13/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2000
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Application #:
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08903996
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Filing Dt:
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07/31/1997
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Title:
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SUBSTRATE FOR HOLDING A CHIP OF SEMI-CONDUCTOR PACKAGE, SEMI-CONDUCTOR PACKAGE, AND FABRICATION PROCESS OF SEMI-CONCUCTOR PACKAGE
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Assignees
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1-1, NISHISHINJUKU, 2-CHOME, SHINJUKU-KU |
TOKYO, JAPAN |
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22-22, NAGAIKECHO, ABENO-KU |
OSAKA-SHI, OSAKA-FU, JAPAN |
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Correspondence name and address
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PENNIE & EDMONDS LLP
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CHARLES E. MILLER
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1155 AVENUE OF THE AMERICAS
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NEW YORK, NEW YORK 10036
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