Patent Assignment Details
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| Reel/Frame: | 009191/0101 | |
| Pages: | 4 |
| | Recorded: | 05/15/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/15/2000
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Application #:
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09080117
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Filing Dt:
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05/15/1998
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Title:
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THERMALLY ENHANCED AND MECHANICALLY BALANCED FLIP CHIP PACKAGE AND METHOD OF FORMING
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Assignee
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| INTELLECTUAL PROPERTY LAW, N50/040-4 |
| 1701 NORTH STREET |
| ENDICOTT, NEW YORK 13760 |
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Correspondence name and address
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CALFEE, HALTER & GRISWOLD LLP
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EILEEN T. MATHEWS
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1400 MCDONALD INVESTMENT CENTER
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800 SUPERIOR AVENUE
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CLEVELAND, OHIO 44114-2688
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