Patent Assignment Details
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| Reel/Frame: | 009296/0974 | |
| Pages: | 3 |
| | Recorded: | 07/07/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/04/2000
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Application #:
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09078668
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Filing Dt:
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05/14/1998
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Title:
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ABRASIVE MATERIAL FOR POLISHING A SEMICONDUCTOR WAFER, AND METHODS FOR MANUFACTURING AND USING THE ABRASIVE MATERIAL
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Assignees
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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| 1-1, MIKAGECHO, TOKUYAMA-SHI |
| YAMAGUCHI-KEN, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ET AL
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MR. ERNEST F. CHAPMAN
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005-3315
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