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Reel/Frame:009298/0132   Pages: 3
Recorded: 06/30/1998
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/12/2000
Application #:
09050666
Filing Dt:
03/30/1998
Title:
METHOD OF MAKING INTEGRATED CIRCUIT PACKAGE HAVING ADHESIVE BEAD SUPPORTING PLANAR LID ABOVE PLANAR SUBSTRATE
Assignor
1
Exec Dt:
04/14/1998
Assignee
1
1900 SOUTH PRICE ROAD
CHANDLER, ARIZONA 85248
Correspondence name and address
SKJERVEN, MORRILL, MACPHERSON ET AL.
JAMES E. PARSONS
25 METRO DRIVE
SUITE 700
SAN JOSE, CA 95110

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