Patent Assignment Details
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Reel/Frame: | 009384/0358 | |
| Pages: | 4 |
| | Recorded: | 08/03/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/15/2001
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Application #:
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09082889
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Filing Dt:
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05/21/1998
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Title:
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HOT-MELT ADHESIVE SHEET AND SEMICONDUCTOR DEVICES
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Assignee
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AIG BUILDING |
1-3, MARUNOUCHI 1-CHOME, CHIYODA-KU |
TOKYO 100-0005, JAPAN |
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Correspondence name and address
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DOW CORNING CORPORATION
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LARRY A. MILCO
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PATENT DEPARTMENT - C01232
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P.O. BOX 994
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MIDLAND, MI 48686-0994
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