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Patent Assignment Details
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Reel/Frame:009395/0543   Pages: 9
Recorded: 08/17/1998
Conveyance: MERGER AND CHANGE OF NAME
Total properties: 1
1
Patent #:
Issue Dt:
09/15/1998
Application #:
08707381
Filing Dt:
09/04/1996
Title:
METHOD FOR FABRICATING A HEAT SINK-INTEGRATED SEMICONDUCTOR PACKAGE
Assignors
1
Exec Dt:
03/20/1998
2
Exec Dt:
04/14/1998
Assignees
1
280-8, 2GA, SUNGSU-DONG, SUNGDONG-KU
SEOUL, KOREA, REPUBLIC OF
2
1900 SOUTH PRICE ROAD
CHANDLER, ARIZONA 85248
Correspondence name and address
SKJERVEN, MORRILL, MACPHERSON, FRANKLIN
& FRIEL LLP
ALAN H. MACPHERSON
25 METRO DRIVE, SUITE 700
SAN JOSE, CA 95110

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