Patent Assignment Details
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| Reel/Frame: | 009404/0868 | |
| Pages: | 8 |
| | Recorded: | 08/21/1998 | | |
| Conveyance: | CHANGE OF NAME AND MERGER |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/01/1999
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Application #:
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08813725
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Filing Dt:
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03/07/1997
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Title:
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METHOD OF FORMING CHIP BUMPS OF BUMP CHIP SCALE SEMICONDUCTOR PACKAGE
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Assignees
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| 280-8, 2GA, SUNGSU-DONG, SUNGDONG-KU |
| SEOUL, KOREA, REPUBLIC OF |
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON, ET AL
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ALAN H. MACPHERSON
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CALIFORNIA 95110
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