Patent Assignment Details
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| Reel/Frame: | 009413/0570 | |
| Pages: | 8 |
| | Recorded: | 08/28/1998 | | |
| Conveyance: | CHANGE OF NAME/MERGER |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/16/1999
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Application #:
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08825945
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Filing Dt:
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04/01/1997
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Title:
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SOLDER BALL LAND METAL STRUCTURE OF BALL GRID SEMICONDUCTOR PACKAGE
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Assignees
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| 280-8, 2GA, SUNGSU-DONG, SUNDONG-KU |
| SEOUL, KOREA, REPUBLIC OF |
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON, ET AL
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THOMAS S. MACDONALD
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25 METRO DRIVE
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SUITE 700
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SAN JOSE, CA 95110
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