Patent Assignment Details
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| Reel/Frame: | 009485/0797 | |
| Pages: | 2 |
| | Recorded: | 09/28/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/25/2003
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Application #:
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09115378
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Filing Dt:
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07/14/1998
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Title:
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SEMICONDUCTOR DIE PAD PLACEMENT AND WIRE BOND
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 4, CREATION ROAD III |
| HSINCHU, TAIWAN R.O.C |
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Correspondence name and address
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PROSKAUER ROSE LLP
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EVAN L. KAHN
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1585 BROADWAY
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NEW YORK, NEW YORK 10036
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