Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 009488/0219 | |
| Pages: | 3 |
| | Recorded: | 09/22/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2001
|
Application #:
|
09158299
|
Filing Dt:
|
09/22/1998
|
|
Title:
|
SEMICONDUCTOR CHIP BONDED TO A THERMAL CONDUCTIVE SHEET HAVING THROUGH HOLE FOR ELECTRICAL CONNECTION
|
|
|
Assignee
|
|
|
|
|
| 1006-BANCHI, OAZA-KADOMA |
| KADOMA-SHI, OSAKA 571-8501, JAPAN |
|
|
Correspondence name and address
|
| |
MERCHANT GOULD, SMITH, ET AL.
|
| |
DOUGLAS P. MUELLER
|
| |
3100 NORWEST CENTER
|
| |
90 SOUTH SEVENTH STREET
|
| |
MINNEAPOLIS, MN 55402-4131
|
Search Results as of:
04/29/2024 09:47 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
