Patent Assignment Details
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Reel/Frame: | 009491/0442 | |
| Pages: | 4 |
| | Recorded: | 09/28/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/11/2000
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Application #:
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09162247
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Filing Dt:
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09/28/1998
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Title:
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BOND PAD FOR A FLIP-CHIP PACKAGE, AND METHOD OF FORMING THE SAME
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Assignee
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600 MOUNTAIN AVENUE, P.O. BOX 636 |
MURRAY HILL, NEW JERSEY 07974 |
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Correspondence name and address
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DUANE, MORRIS & HECKSCHER LLP
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WILLIAM H. MURRAY, ESQUIRE
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ONE LIBERTY PLACE
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PHILADELPHIA, PA 19103-7396
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