Patent Assignment Details
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| Reel/Frame: | 009503/0814 | |
| Pages: | 3 |
| | Recorded: | 10/13/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/04/2004
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Application #:
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09119626
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Filing Dt:
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07/21/1998
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Publication #:
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Pub Dt:
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09/06/2001
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Title:
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CIRCUIT BOARD HAVING BONDING AREAS TO BE JOINED WITH BUMPS BY ULTRASONIC BONDING
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Assignee
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| CHUO-KU |
| 13-1, NIHONBASHI 1-CHOME |
| TOKYO, JAPAN |
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Correspondence name and address
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OBLON, SPIVAK, MCCLELLAND, ET AL.
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MARVIN J. SPIVAK
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1755 JEFFERSON DAVIS HIGHWAY, 4TH FLOOR
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ARLINGTON, VA 22202
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