Patent Assignment Details
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| Reel/Frame: | 009548/0028 | |
| Pages: | 3 |
| | Recorded: | 10/23/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/27/2001
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Application #:
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09178464
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Filing Dt:
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10/23/1998
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Publication #:
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Pub Dt:
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10/25/2001
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Title:
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STRUCTURE FOR A MULTI-LAYERED DIELECTRIC LAYER AND MANUFACTURING METHOD THEREOF
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 4, CREATION ROAD III |
| HSINCHU, TAIWAN |
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Correspondence name and address
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J.C. PATENTS, INC.
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JIAWEI HUANG
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1340 REYNOLDS AVENUE
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SUITE 114
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IRVINE, CA 92614
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