Patent Assignment Details
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| Reel/Frame: | 009561/0817 | |
| Pages: | 2 |
| | Recorded: | 10/26/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/17/2001
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Application #:
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09179154
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Filing Dt:
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10/26/1998
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Title:
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MOLD-BGA-TYPE SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
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Assignee
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| 7-1, SHIBA 5-CHOMEM MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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HELFGOTT & KARAS, P.C.
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SAMSON HELFGOTT
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EMPIRE STATE BUILDING, 60TH FLOOR
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350 5TH AVENUE
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NEW YORK, NY 10118
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