Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 009566/0359 | |
| Pages: | 2 |
| | Recorded: | 11/04/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2001
|
Application #:
|
09185901
|
Filing Dt:
|
11/04/1998
|
Title:
|
METHOD FOR HEAT TREATMENT OF SOI WAFER AND SOI WAFER HEAT-TREATED BY THE METHOD
|
|
Assignee
|
|
|
4-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
|
Correspondence name and address
|
|
LOEB & LOEB LLP
|
|
WILLIAM H. WRIGHT, ESQ.
|
|
10100 SANTA MONICA BLVD.
|
|
22ND FLOOR
|
|
LOS ANGELES, CA 90067-4164
|
Search Results as of:
04/27/2024 12:32 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|