Patent Assignment Details
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| Reel/Frame: | 009586/0565 | |
| Pages: | 8 |
| | Recorded: | 11/16/1998 | | |
| Conveyance: | MERGER AND CHANGE OF NAME |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/17/1998
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Application #:
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08588172
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Filing Dt:
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01/18/1996
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION AND DEHUMIDIFICATION EFFECT
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Assignees
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| 280-8, 2-GA, SUNGSU-DONG, SUNGDONG-KU |
| SEOUL, KOREA, REPUBLIC OF |
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON ET AL.
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THOMAS S. MACDONALD
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25 METRO DRIVE
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SUITE 700
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SAN JOSE, CA 95110
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