Patent Assignment Details
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| Reel/Frame: | 009586/0641 | |
| Pages: | 8 |
| | Recorded: | 11/16/1998 | | |
| Conveyance: | MERGER AND CHANGE OF NAME |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/24/1997
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Application #:
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08588482
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Filing Dt:
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01/18/1996
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Title:
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METHOD AND CIRCUIT BOARD STRUCTURE FOR LEVELING SOLDER BALLS IN BALL GRID ARRAY SEMICONDUCTOR PACKAGES
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Assignees
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| 280-8, 2GA, SUNGSU-DONG, SUNGDONG-KU |
| SEOUL, KOREA, REPUBLIC OF |
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON ET AL
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THOMAS S. MACDONALD
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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