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Reel/Frame:009586/0649   Pages: 3
Recorded: 11/16/1998
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/03/1995
Application #:
08152935
Filing Dt:
11/15/1993
Title:
PLASTIC MOLDED PACKAGE WITH HEAT SINK FOR INTEGRATED CIRCUIT DEVICES
Assignor
1
Exec Dt:
04/14/1998
Assignee
1
1900 SOUTH PRICE ROAD
CHANDLER, ARIZONA 85248
Correspondence name and address
SKJERVEN, MORRILL, MACPHERSON, ETAL
ALAN H. MACPHERSON
25 METRO DRIVE, SUITE 700
SAN JOSE, CA 95110

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