Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 009586/0689 | |
| Pages: | 8 |
| | Recorded: | 11/16/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/10/1997
|
Application #:
|
08729540
|
Filing Dt:
|
10/11/1996
|
|
Title:
|
METHOD FOR MOLDING OF INTEGRATED CIRCUIT PACKAGE
|
|
|
Assignees
|
|
|
|
|
| 280-8, 2GA SUNGSU-DONG, SUNGDON-KU |
| SEOUL, KOREA, REPUBLIC OF |
|
|
|
|
|
| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
|
|
Correspondence name and address
|
| |
SKJERVEN, MORRILL MACPHERSON, FRANKLIN &
|
| |
FRIEL LLP
|
| |
THOMAS S. MACDONALD
|
| |
25 METRO DRIVE, SUITE 700
|
| |
SAN JOSE, CA 95110
|
Search Results as of:
05/15/2024 03:54 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
