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Patent Assignment Details
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Reel/Frame:009676/0549   Pages: 4
Recorded: 12/22/1998
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/16/1999
Application #:
09218656
Filing Dt:
12/22/1998
Title:
COMPACT ASSEMBLY CONFIGURATION AND PROCESS FOR REDUCING LEAD WIRE CONNECTIONS AND SOLDER JOINTS
Assignors
1
Exec Dt:
12/18/1998
2
Exec Dt:
12/18/1998
3
Exec Dt:
12/18/1998
Assignee
1
144 MIN-CHUAN E. RD. SEC. 3
9TH FLOOR, ASIA ENTERPRISE CENTER
TAIPEI 10464, TAIWAN R.O.C
Correspondence name and address
BO-IN LIN
13445 MANDOLI DRIVE
LOS ALTOS HILLS, CA 94022

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