Patent Assignment Details
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Reel/Frame: | 009676/0549 | |
| Pages: | 4 |
| | Recorded: | 12/22/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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09218656
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Filing Dt:
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12/22/1998
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Title:
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COMPACT ASSEMBLY CONFIGURATION AND PROCESS FOR REDUCING LEAD WIRE CONNECTIONS AND SOLDER JOINTS
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Assignee
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144 MIN-CHUAN E. RD. SEC. 3 |
9TH FLOOR, ASIA ENTERPRISE CENTER |
TAIPEI 10464, TAIWAN R.O.C |
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Correspondence name and address
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BO-IN LIN
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13445 MANDOLI DRIVE
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LOS ALTOS HILLS, CA 94022
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