Patent Assignment Details
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| Reel/Frame: | 009713/0100 | |
| Pages: | 2 |
| | Recorded: | 01/25/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/11/1999
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Application #:
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08802134
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Filing Dt:
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02/19/1997
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Title:
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SEMICONDUCTOR ASSEMBLY WITH SOLDER MATERIAL LAYER AND METHOD FOR SOLDERING THE SEMICONDUCTOR ASSEMBLY
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Assignee
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| ZT GG VM |
| POSTFACH 22 16 34 |
| MUENCHEN, GERMANY 80506 |
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Correspondence name and address
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LERNER AND GREENBERG
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LAURENCE A. GREENBERG
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P.O. BOX 2480
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HOLLYWOOD, FL 33022
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