Patent Assignment Details
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| Reel/Frame: | 009749/0799 | |
| Pages: | 4 |
| | Recorded: | 02/08/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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09217075
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Filing Dt:
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12/21/1998
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Title:
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SILICON-CONTAINING POLYIMIDE RESIN AND SILICON-CONTAINING POLYAMIC ACID
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Assignee
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| AIG BUILDING, 4TH FLOOR, 1-1-3, MARUNOUCHI |
| CHIYODA-KU-TOKYO 100-0005, JAPAN |
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Correspondence name and address
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DOW CORNING CORPORATION
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ALEXANDER WEITZ
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PATENT DEPARTMENT-MAIL CO1232
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MIDLAND, MI 48686-0994
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