Patent Assignment Details
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| Reel/Frame: | 009772/0949 | |
| Pages: | 3 |
| | Recorded: | 02/16/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/20/2000
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Application #:
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09249881
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Filing Dt:
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02/16/1999
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Title:
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LEAD FRAME STRUCTURE FOR PREVENTING THE WARPING OF SEMICONDUCTOR PACKAGE BODY
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Assignees
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| EAST 1ST STREET |
| K.E.P.Z., KAOHSIUNG, TAIWAN, CHINA |
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| INDUSTRIAL PARK |
| NO. 6 SHIH CHIEN ROAD, HU KOU, HSINCHU |
| HSINCHU, TAIWAN, CHINA |
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Correspondence name and address
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J.C. PATENTS, INC.
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JIAWEI HUANG
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1340 REYNOLDS AVENUE
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SUITE 114
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IRVINE, CA 92614
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