Patent Assignment Details
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| Reel/Frame: | 009791/0859 | |
| Pages: | 2 |
| | Recorded: | 02/19/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/16/2001
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Application #:
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09253450
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Filing Dt:
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02/19/1999
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Title:
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FLIP-CHIP BONDING METHOD AND APPARATUS
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Assignee
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| 2-51-1, INADAIRA, MUSASHI MURAYAMA-SHI |
| TOKYO, JAPAN |
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Correspondence name and address
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KODA & ANDROLIA
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H.HENRY KODA
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10100 SANTA MONICA BLVD.
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SUITE 2340
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LOS ANGELES, CA 90067
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