Patent Assignment Details
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| Reel/Frame: | 009840/0797 | |
| Pages: | 3 |
| | Recorded: | 03/25/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/19/2001
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Application #:
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09250282
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Filing Dt:
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02/16/1999
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Title:
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CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| 2701-1, AZA-IWAKURA, HIGASHIBUN, OMINE-CHO |
| MINE-SHI, YAMAGUCHI 759-2212, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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WARREN M. CHEEK, JR.
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2033 K STREET, N.W.
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SUITE 800
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WASHINGTON, DC 20006
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