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Patent Assignment Details
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Reel/Frame:009848/0842   Pages: 3
Recorded: 03/18/1999
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/29/2002
Application #:
09272754
Filing Dt:
03/18/1999
Title:
MOLD FOR FABRICATING SEMICONDUCTOR DEVICES
Assignors
1
Exec Dt:
02/17/1999
2
Exec Dt:
02/17/1999
3
Exec Dt:
02/17/1999
4
Exec Dt:
02/17/1999
5
Exec Dt:
02/17/1999
6
Exec Dt:
02/17/1999
7
Exec Dt:
02/17/1999
Assignee
1
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Correspondence name and address
ARMSTRONG, WESTERMAN, HATTORI ET AL.
STEPHEN G. ADRIAN
1725 K STREET N.W., SUITE 1000
WASHINGTON, DC 20006

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