Patent Assignment Details
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| Reel/Frame: | 009850/0840 | |
| Pages: | 4 |
| | Recorded: | 03/17/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/13/2001
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Application #:
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09271257
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Filing Dt:
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03/17/1999
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES SEPARATED FROM A WAFER
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Assignee
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| CHIYODA-KU |
| 2-3, MARUNOUCHI 2-CHOME |
| TOKYO, JAPAN 100-8 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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JEFFREY A. WYAND
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700 THIRTEENTH STREET, NW
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SUITE 300
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WASHINGTON, DC 20005
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