Patent Assignment Details
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Reel/Frame: | 009873/0414 | |
| Pages: | 2 |
| | Recorded: | 04/05/1999 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/27/2000
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Application #:
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09285971
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Filing Dt:
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04/05/1999
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Title:
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SEMICONDUCTOR CHIP PACKAGE STRUCTURE
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Assignee
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NAGANO-SHI, |
711, AZA SHARIDEN, OAZA KURITA, |
NAGANO 380-0921, JAPAN |
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Correspondence name and address
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PENNIE & EDMONDS LLP
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ALLAN A. FANUCCI
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1155 AVENUE OF THE AMERICAS
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NEW YORK, NY 10O36
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