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Patent Assignment Details
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Reel/Frame:009929/0640   Pages: 2
Recorded: 04/21/1999
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/19/2000
Application #:
09249142
Filing Dt:
02/12/1999
Title:
METHOD FOR FABRICATING SEMICONDUCTOR WAFERS
Assignors
1
Exec Dt:
03/24/1999
2
Exec Dt:
03/25/1999
3
Exec Dt:
03/26/1999
4
Exec Dt:
03/29/1999
5
Exec Dt:
04/02/1999
6
Exec Dt:
04/06/1999
Assignee
1
2612, SHINOMIYA, HIRATSUKA-SHI
KANAGAWA, JAPAN
Correspondence name and address
R. EUGENE VARNDELL, JR.
VARNDELL LEGAL GROUP
SUITE 220, 1150 S. WASHINGTON ST.
ALEXANDRIA, VA 22314

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