skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:009972/0233   Pages: 3
Recorded: 05/21/1999
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/13/2001
Application #:
09220343
Filing Dt:
12/24/1998
Title:
SOLDER MATERIAL AND METHOD OF MANUFACTURING SOLDER MATERIAL
Assignors
1
Exec Dt:
12/16/1998
2
Exec Dt:
12/16/1998
3
Exec Dt:
12/16/1998
4
Exec Dt:
12/16/1998
Assignee
1
72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI
KANAGAWA-KEN, JAPAN
Correspondence name and address
OBLON, SPIVAK, MCCLELLAND, MAIER ET AL.
NORMAN F. OBLON
ATTORNEYS AT LAW, FOURTH FLOOR
1755 JEFFERSON DAVIS HIGHWAY
ARLINGTON, VIRGINIA 22202

Search Results as of: 04/27/2024 11:13 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT