Patent Assignment Details
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| Reel/Frame: | 009993/0968 | |
| Pages: | 2 |
| | Recorded: | 05/24/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/20/2001
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Application #:
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09317537
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Filing Dt:
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05/24/1999
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Title:
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METHOD FOR MANUFACTURING A CHIP SCALE PACKAGE HAVING COOPER TRACES SELECTIVELY PLATED WITH GOLD
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Assignee
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| 416 MAETAN-DONG, PALDAL-KU, SUWON-CITY |
| KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON, FRANKLIN
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& FRIEL LLP
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DON C. LAWRENCE
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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