Patent Assignment Details
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| Reel/Frame: | 010005/0117 | |
| Pages: | 3 |
| | Recorded: | 06/01/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09323464
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Filing Dt:
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06/01/1999
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Title:
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CONDUCTIVE PASTE AND SEMICONDUCTOR COMPONENT HAVING CONDUCTIVE BUMPS MADE FROM THE CONDUCTIVE PASTE
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Assignee
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| INTELLECTUAL PROPERTY DEPT. |
| 1303 EAST ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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RENNIE WILLIAM DOVER
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INTELLECTUAL PROPERTY DEPT., STE R3108
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P.O. BOX 10219
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SCOTTSDALE, AZ 85271-0219
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