Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 010073/0735 | |
| Pages: | 3 |
| | Recorded: | 06/20/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2001
|
Application #:
|
09340400
|
Filing Dt:
|
06/28/1999
|
|
Title:
|
METHOD FOR ETCHING A POLY-SILICON LAYER OF A SEMICONDUCTOR WAFER
|
|
|
Assignee
|
|
|
|
|
| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN ROAD 2 |
| HSIN-CHU, TAIWAN R.O.C |
|
|
Correspondence name and address
|
| |
WINSTON HSU
|
| |
3F, NO. 52, LANE 46, MIN-SHENG RD.
|
| |
YUNG-HO CITY, TAIPEI HSIEN
|
| |
TAIWAN, R.O.C.
|
Search Results as of:
05/05/2024 11:18 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
