Patent Assignment Details
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| Reel/Frame: | 010077/0935 | |
| Pages: | 3 |
| | Recorded: | 07/06/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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11/02/1999
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Application #:
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09025564
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Filing Dt:
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02/18/1998
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Title:
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METHOD AND APPARATUS FOR REMOVING DIE FROM AN EXPANDED WAFER AND CONVEYING DIE TO A PICKUP LOCATION
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Patent #:
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Issue Dt:
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01/16/2001
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Application #:
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09251541
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Filing Dt:
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02/17/1999
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Title:
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METHOD AND APPARATUS FOR REMOVING DIE FROM A WAFER AND CONVEYING DIE TO A PICKUP LOCATION
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Assignee
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| A NEW YORK CORPORATION |
| 10 TURNER DRIVE |
| SPENCERPORT, NEW YORK 14559 |
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Correspondence name and address
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LEONARD HEYMAN
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508 ROCKINGHAM STREET
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ROCHESTER, NY 14620
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