Patent Assignment Details
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Reel/Frame: | 010171/0295 | |
| Pages: | 2 |
| | Recorded: | 08/10/1999 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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09371101
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Filing Dt:
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08/10/1999
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Title:
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DICING TAPE AND A METHOD OF DICING A SEMICONDUCTOR WAFER
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Assignee
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23-23 HONCHO |
ITABASHI-KU, TOKYO 173-0001, JAPAN |
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Correspondence name and address
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BURGESS, RYAN AND WAYNE
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MILTON J. WAYNE
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370 LEXINGTON AVENUE, SUITE 2105
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NEW YORK, NY 10017
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