Patent Assignment Details
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| Reel/Frame: | 010183/0088 | |
| Pages: | 3 |
| | Recorded: | 07/21/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/18/2001
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Application #:
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09341918
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Filing Dt:
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07/21/1999
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Title:
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RESIN-MOLDED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| 1-1, SAIWAI-CHO, TAKATSUKI-SHI |
| OSAKA 561-1193, JAPAN |
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Correspondence name and address
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SIXBEY, FRIEDMAN, LEEDOM & FERGUSON, PC
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ERIC J. ROBINSON
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8180 GREENSBORO DRIVE, SUITE 800
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MCLEAN, VA 22102
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