Patent Assignment Details
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| Reel/Frame: | 010194/0112 | |
| Pages: | 3 |
| | Recorded: | 08/25/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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09383150
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Filing Dt:
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08/25/1999
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Title:
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LEAD FRAME FOR A SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP PACKAGE INCORPORATING MULTIPLE INTEGRATED CIRCUIT CHIPS, AND METHOD OF FABRICATING A SEMICONDUCTOR CHIP PACKAGE WITH MULTIPLE INTEGRATED CIRCUIT CHIPS
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 4 R & D 3RD ROAD |
| HSINCHU CITY, TAIWAN |
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Correspondence name and address
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CHRISTIE, PARKER & HALE, LLP
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D. BRUCE PROUT
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P.O. BOX 7068
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PASADENA, CA 91109-7068
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