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Patent Assignment Details
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Reel/Frame:010214/0441   Pages: 4
Recorded: 08/30/1999
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/24/2002
Application #:
09385765
Filing Dt:
08/30/1999
Publication #:
Pub Dt:
06/13/2002
Title:
APPARATUS AND METHODS FOR PROVIDING SUBSTRATE STRUCTURES HAVING METALLIC LAYERS FOR MICROELECTRONICS DEVICES
Assignors
1
Exec Dt:
08/23/1999
2
Exec Dt:
08/23/1999
Assignee
1
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83706
Correspondence name and address
SEED AND BERRY LLP
DALE C. BARR
701 FIFTH AVE.
6300 COLUMBIA CENTER
SEATTLE, WA 98104-7092

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