Patent Assignment Details
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| Reel/Frame: | 010277/0473 | |
| Pages: | 2 |
| | Recorded: | 10/01/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/08/2000
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Application #:
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08815907
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Filing Dt:
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03/12/1997
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Title:
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SEMICONDUCTOR DICING AND ASSEMBLING METHOD
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Assignee
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| 8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI |
| CHIBA, JAPAN |
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Correspondence name and address
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LOEB & LOEB LLP
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WILLIAM H. WRIGHT
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10100 SANTA MONICA BOULEVARD, 22ND FLOOR
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LOS ANGELES, CA 90067-4164
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