Patent Assignment Details
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| Reel/Frame: | 010335/0724 | |
| Pages: | 3 |
| | Recorded: | 03/19/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09147824
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Filing Dt:
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03/15/1999
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Title:
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PROCESS FOR MANUFACTURING SEMICONDUCTOR WAFER, PROCESS FOR MANUFACTURING SEMICONDUCTOR CHIP, AND IC CARD
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Assignee
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU |
| KYOTO-SHI, KYOTO 615-8585, JAPAN |
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Correspondence name and address
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NIKAIDO, MARMELSTEIN, MURRAY & ORAM LLP
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GEORGE E. ORAM, JR.
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METROPOLITAN SQUARE, SUITE 330
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655 15TH ST., N.W., G STREET LOBBY
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WASHINGTON, D.C. 20005-5701
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