Patent Assignment Details
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| Reel/Frame: | 010360/0733 | |
| Pages: | 11 |
| | Recorded: | 11/03/1999 | | |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/08/1998
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Application #:
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08853852
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Filing Dt:
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05/09/1997
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Title:
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ELECTRONIC CIRCUIT BONDING INTERCONNECT COMPONENT AND FLIP CHIP INTERCONNECT BOND
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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WELLS, ST. JOHN, ROBERTS GREGORY ET AL
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MARK S. MATKIN, ESQ
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601 W. FIRST AVENUE
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SUITE 1300
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SPOKANE, WA 99201-3828
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