Patent Assignment Details
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| Reel/Frame: | 010370/0853 | |
| Pages: | 3 |
| | Recorded: | 11/03/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09432216
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Filing Dt:
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11/03/1999
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Title:
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LEADFRAME FOR USE IN MANUFACTURING A RESIN-MOLDED SEMICONDUCTOR DEVICE
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Assignee
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| TAKATSUKI-SHI |
| 1-1, SAIWAI-CHO |
| OSAKA, JAPAN 569-1 |
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Correspondence name and address
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SIXBEY, FRIEDMAN, LEEDOM ET AL.
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ERIC J. ROBINSON
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8180 GREENSBORO DRIVE
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SUITE 800
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MCLEAN, VA 22102
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