Patent Assignment Details
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| Reel/Frame: | 010414/0952 | |
| Pages: | 4 |
| | Recorded: | 11/29/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/04/2001
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Application #:
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09188020
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Filing Dt:
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11/06/1998
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Title:
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ADHESION PROMOTION METHOD FOR ELECTRO-CHEMICAL COPPER METALLIZATION IN IC APPLICATIONS
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Assignee
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| 5750 NW PACIFIC RIM BOULEVARD |
| CAMAS, WASHINGTON 98607 |
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Correspondence name and address
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SHARP LABORATORIES OF AMERICA, INC.
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DAVID C. RIPMA
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5750 NW PACIFIC RIM BOULEVARD
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CAMAS, WA 98607
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