Patent Assignment Details
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| Reel/Frame: | 010428/0630 | |
| Pages: | 3 |
| | Recorded: | 11/30/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09450545
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Filing Dt:
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11/30/1999
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Title:
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PROCESS TO MAKE A TALL SOLDER BALL BY PLACING A EUTECTIC SOLDER BALL ON TOP OF A HIGH LEAD SOLDER BALL
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 121 PARK AVENUE 3 |
| HSIN-CHU, TAIWAN ROC |
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Correspondence name and address
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TUNG & ASSOCIATES
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RANDY W. TUNG
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838 W. LONG LAKE ROAD
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SUITE 120
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BLOOMFIELD HILLS, MI 48302
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