Patent Assignment Details
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| Reel/Frame: | 010454/0345 | |
| Pages: | 4 |
| | Recorded: | 12/22/1999 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO ADD ADDITIONAL ASSIGNEE TO THE ASSIGNMENT DATA PREVIOUSLY RECORDED AT REEL 8229 FRAME 0710. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/23/1997
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Application #:
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08688173
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Filing Dt:
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07/29/1996
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND PROCESS OF AND APPARATUS FOR GRINDING USED FOR THE SAME METHOD OF MANUFACTURE
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Assignees
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| TOGINBIRU, 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO 100, JAPAN |
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| 5-3-38, UJINA-HIGASHI, MINAMI-KU, |
| HIROSHIMA-SHI, HIROSHIMA, JAPAN |
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Correspondence name and address
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EVENSON, MCKEOWN, EDWARDS ET AL.
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J. D. EVANS
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1200 G STREET, NW
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SUITE 700
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WASHINGTON, DC 20005
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