Patent Assignment Details
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| Reel/Frame: | 010482/0456 | |
| Pages: | 7 |
| | Recorded: | 12/10/1999 | | |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/22/2000
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Application #:
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08949585
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Filing Dt:
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10/14/1997
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Title:
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A MICROELECTRONIC DEVICE PACKAGE HAVING A HEAT SINK STRUCTURE FOR INCREASING THE THERMAL CONDUCTIVITY OF THE PACKAGE
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Assignee
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON ET AL.
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THEODORE P. LOPEZ
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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