Patent Assignment Details
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| Reel/Frame: | 010483/0172 | |
| Pages: | 2 |
| | Recorded: | 12/22/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/20/2003
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Application #:
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09469351
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Filing Dt:
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12/22/1999
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Title:
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WAFER FORMED WITH CSP DEVICE AND TEST SOCKET OF BGA DEVICE
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Assignee
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| 9-2 CHAAM-DONG, CHUNAN-SHI |
| CHOONGCHUNGNAM-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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ROBERT L. PRICE
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600 13TH STREET, N.W.
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WASHINGTON, DC 20005
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