Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 010511/0305 | |
| Pages: | 2 |
| | Recorded: | 01/14/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2002
|
Application #:
|
09482609
|
Filing Dt:
|
01/14/2000
|
Title:
|
FLEXIBLE PACKAGE HAVING VERY THN SEMICONDUCTOR CHIP, MODULE AND MULTI CHIP MODULE (MCM) ASSEMBLED BY THE PACKAGE, AND METHOD FOR MANUFACTURING THE SAME
|
|
Assignee
|
|
|
72 HORIKAWA-CHO, SAIWAI-KU |
KAWASAKI-SHI, KANAGAWA-KEN, JAPAN |
|
Correspondence name and address
|
|
FINNEGAN, HENDERSON, FARABOW ETAL
|
|
MR. ERNEST F. CHAPMAN
|
|
1300 I STREET, N.W.
|
|
WASHINGTON, DC 20005-3315
|
Search Results as of:
05/03/2024 12:42 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|