Patent Assignment Details
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Reel/Frame: | 010518/0472 | |
| Pages: | 2 |
| | Recorded: | 01/18/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09483875
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Filing Dt:
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01/18/2000
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Title:
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Apparatus and method to polish a wafer using abrasive flow
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Assignees
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SCIENCE-BASED INDUSTRIAL PARK |
3F, NO. 19, LI HSIN RD., |
HSINCHU, TAIWAN R.O.C |
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 19, LI HSIN RD. |
HSINCHU, TAIWAN R.O.C |
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SCIENCE-BASED INDUSTRIAL PARK |
WITTELSBACHERPLATZ 2 |
MUNCHEN, GERMANY D-803 |
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Correspondence name and address
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DARBY & DARBY P.C.
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YA-CHIAO CHANG, ESQ.
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805 THIRD AVENUE, 27TH FLOOR
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NEW YORK, NY 10022-7513
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